List of products by brand Termopasty

Thermal Conductive Pad TO220 18x13x0.3mm 1.5W/mK features:
- The thermal conductive pads with a thermal conductivity of 1.5 W / mK, are a good thermal conductor and at the same time a good electrical insulator
- A double-sided adhesive product, reinforced with fiberglass
- Dimensions: 18x13x0,3mm

Thermal Conductive Pad TO247 23x18x0.3mm 1.5W/mK features:
- The thermal conductive pads with a thermal conductivity of 1.5 W / mK, are a good thermal conductor and at the same time a good electrical insulator
- A double-sided adhesive product, reinforced with fiberglass.
- Dimensions: 23x18x0,3mm

Thermal Conductive Pad TO3 41.5x28.2x0.3mm 1.5W/mK features:
- The thermal conductive pads with a thermal conductivity of 1.5 W / mK, are a good thermal conductor and at the same time a good electrical insulator
- A double-sided adhesive product, reinforced with fiberglass
- Dimensions: 41.5x28.2x0.3mm

The transfer of heat between the electronic components and the radiator is facilitated.
It is necessary for the correct operation of any type of temperature sensors.
It is characterized by a very good chemical resistance for oxidation, water solutions of acids, alkalis and salts, sulfur dioxide and ammonia. Thermo Conductive Grease Paste 340°C 3D Prusa 100g features:
- It has a very wide range of working temperatures: -30 °C ~ 300 °C
- Maximum momentary working temperature 340 °C
- Thermal conductivity> 1.5 W / mK

Thermal Pad Silicone Heat Pad CPU GPU features:
- The transfer of heat between the electronic components and the radiator is facilitated.
- Thermal conductivity 1,5W / mK
- Thickness 1mm quantity: 1 unit
- High quality - manufactured in EU
- Thermopad 100x20x1mm
- Thermally conductive tapes are used if the application of a thermal paste is not possible. The tapes are extremely flexible. Their high compressibility ensures excellent adjustment to elements in need of cooling

Thermal Pad Silicone Heat GPU CPU 130x20x1mm. The tapes are thermally used as an application of a thermal paste.

Copper-based thermal paste designed to improve processor cooling Thermal Paste Syringe 3.1W / mK CPU features:
- The thermal conductivity of ~ 3.1 W/mK
- Not suitable for aluminum radiators
- No driver
- 1,5ml content

Thermally Conductive Silicone Paste H facilitates the transfer of calories between the electronic components and the radiator.
It is necessary for the correct operation of any type of temperature sensors.

Thermally Conductive Silicone Paste H facilitates the transfer of heat between the electronic components and the radiator. It is necessary for the correct operation of any type of temperature sensors. Global coefficient of heat transfer at 0-150 ° C: 0.88 W / m K

Thermally Conductive Silicone Paste facilitates the transfer of heat between the electronic components and the radiator. It is necessary for the correct operation of any type of temperature sensors. It is characterized by a very good chemical resistance for oxidation, water solutions of acids, alkalis and salts, sulfur dioxide and ammonia.

Thermo Silicone Paste Cleaner features:
This product is safe and easy to use with a pleasant aroma of citrus.
It is used to eliminate old conductive pastes from heat, worn out. How to use: - It is recommended to remove the most amount of paste consumed a small amount of liquid applied to the fabric applied to the surface that is cleaned
- Wait 1-2 minutes
- Clean with a cloth

TO Thermal Conductive Pad 26x26x0.3mm 1.5W/mK features:
- The thermal conductive pads with a thermal conductivity of 1.5 W / mK, are a good thermal conductor and at the same time a good electrical insulator
- A double-sided adhesive product, reinforced with fiberglass
- Dimensions: 26x26x0,3mm

Necessary for the protection of printed circuits.
PCB varnish of high quality for manufacturing, repair and maintenance.
Prevents the oxidation of printed circuit boards during intermediate storage. Transparent Insulating PCB Varnish 60 1 Liter features:
- A protective film, transparent
- Protects soft metals for welding (eg copper, steel, lead, tin, brass) against corrosion, moisture, oxidation, dust, chemical contamination
- It maintains the welding, to carry out a subsequent welding it is not necessary to eliminate the protective film
- PVB 60 is used, for example, in the storage of printed circuit boards and material to be welded, such as welding terminals or conductors
- Application temperature: od -40 ° C + 60 ° C

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 011 features:
- Mixing ratio: 100: 8,
- Density: 0.97g / cm3,
- Pre-crosslinking: 30-40 min,
- Working temperature from -50ºC to + 200ºC,
- Viscosity at 25ºC: 2000 cP,
- Transparent color.

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 019 features:
- Manufacturer: TermoPasty,
- Mixing ratio: 100:6,
- Density: 1.2g / cm3,
- Pre-crosslinking: 30-40 min,
- Working temperature from -50ºC to + 200ºC,
- Viscosity at 25ºC: 45000 cP,

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 021 features:
- Manufacturer: TermoPasty,
Mixing ratio: 100: 10,
Thermal conductivity: 1.2 W / mK,
Density: 1.12g / cm3,
Pre-crosslinking: 30-40 min,
Working temperature from -50ºC to + 200ºC,

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 029 features:
- Manufacturer: TermoPasty,
- Mixing ratio: 100: 10,
- Thermal conductivity: 2 W / mK,
- Density: 1.15g / cm3,
- Pre-crosslinking: 30-40 min,
- Working temperature from -50ºC to + 200ºC,

Ultrasonic Cleaning Liquid 1 litre features:
Suitable for use in ultrasonic baths, this cleaner completely removes all traces of contamination including light oils, silicones, etc.

The product provides a good development quality, protecting the sharpness of the color. The formulation is free of NaOH, which significantly increases safety at work.
Universal developer for photo varnish and positive printed circuit boards PCB.

- The product protects PCB plates, allows for easier welding
- The product protects the printed circuit boards against oxidation and corrosion during storage.
- This allows a faster welding and avoids the "cold welding".
- The application method allows easy distribution of the product on the plates.
- Can be used during production, repair, maintenance and service.
Flux Varnish LT-4 Plate Protector features:
- Shape: Spray
- Capacity: 100ml
- Rosin RMA
- Meets the requirements of DIN 8511, F-SW-31, PN EN 29454 1.1.1.A.
Application:
- PCB protection against oxidation,
- Applied in the production of printed circuit boards immediately after engraving,

Aqueous PCB cleaner
Water-based PCB cleaner for removing debris from PCB mounting surfaces after welding, for cleaning welding unit frames, templates and screens.
It causes the saponification of the rosin and the dissolution of the flow residues.
Its action is accelerated by the presence of neutralizers and additives reducing the surface tension.
Does not attack metal and aluminum surfaces.
Water-Based Cleaner PCB features:
- Type of chemical preparation: aqueous stripper of PCB printed plates
- Aqueous cleaner to eliminate fluxes, dirt removal, flux residues in PCB has low impact on electronic components
- Form: Liquid
- Capacity: 1l