Thermal Paste Syringe 3.1W / mK - AG Copper
  • Thermal Paste Syringe 3.1W / mK - AG Copper

Thermal Paste Syringe 3.1W / mK - AG Copper

Q0042

Copper-based thermal paste designed to improve processor cooling Thermal Paste Syringe 3.1W / mK CPU features:
- The thermal conductivity of ~ 3.1 W/mK
- Not suitable for aluminum radiators
- No driver
- 1,5ml content

Termopasty
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Thermal Paste Syringe 3.1W / mK CPU description


Copper-based thermal paste designed to improve processor cooling

Thermal Paste Syringe 3.1W / mK CPU features:


- The thermal conductivity of ~ 3.1 W/mK
- Not suitable for aluminum radiators
- No driver
- 1,5ml content

Data sheet

Tipo
Pasta térmica

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