Silicones and encapsulants

Materials to encapsulate components, to join them together or to protect them from weather conditions. You will find silicone, epoxy resin and other filling compounds.

Silicones and encapsulants

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Showing 1-10 of 10 item(s)

Two-component silicone encapsulating compound 029

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 029 features:
- Manufacturer: TermoPasty,
- Mixing ratio: 100: 10,
- Thermal conductivity: 2 W / mK,
- Density: 1.15g / cm3,
- Pre-crosslinking: 30-40 min,
- Working temperature from -50ºC to + 200ºC,

Q0085

Price €13.90

Two-component silicone encapsulating compound 021

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 021 features:
- Manufacturer: TermoPasty,
Mixing ratio: 100: 10,
Thermal conductivity: 1.2 W / mK,
Density: 1.12g / cm3,
Pre-crosslinking: 30-40 min,
Working temperature from -50ºC to + 200ºC,

Q0084

Price €9.90

Two-component silicone encapsulating compound 019

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 019 features:
- Manufacturer: TermoPasty,
- Mixing ratio: 100:6,
- Density: 1.2g / cm3,
- Pre-crosslinking: 30-40 min,
- Working temperature from -50ºC to + 200ºC,
- Viscosity at 25ºC: 45000 cP,

Q0083

Price €13.90

Two-component silicone encapsulating compound 011

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 011 features:
- Mixing ratio: 100: 8,
- Density: 0.97g / cm3,
- Pre-crosslinking: 30-40 min,
- Working temperature from -50ºC to + 200ºC,
- Viscosity at 25ºC: 2000 cP,
- Transparent color.

Q0082

Price €11.39

Silicone Gun 15W

Silicone Gun 15W features:
- Hot glue hot melt adhesive + 2 bars
- Blister packaging
- Consumption: 15W
- Includes 2 silicone bars 7,4mm x 95mm

H0185

Regular price €4.19 -€0.70 Price €3.49

Silicone compound 031 Double-component gel

The compound perfectly protects the electronics from negative environmental characteristics and protects sensitive modules from vibrations.
The silicone gel is crystalline, resistant to UV light and, therefore, is the perfect material for LED applications.
After curing, it is very soft.
Creates an excellent electrical insulation.
It has a wide range of temperatures, from -55 ° C to 200 ° C.
Silicone compound 031 Double-component gel features:
- Mixing ratio: 3: 2,
- Density: 0.98g / cm3,
- Pre-crosslinking: 50-60 min,
- Working temperature from -50ºC to + 180ºC,
- Viscosity at 25ºC: 2000 cP,
- Transparent color.
Mode of use:
- Clean, degrease and dry the system.

Q0086

Price €9.90

Silicone Gun 60W

Silicone Gun 60W, Hot glue hot melt adhesive + 2 bars, Blister packaging, Consumption: 60W.
Includes 2 silicone bars 11mm x 95mm

H0125

Regular price €8.90 -€1.50 Price €7.40

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