Spray Contact Cleaner Kontakt S 300ml Spray Contact Cleaner 300ml features:A preparation for removing oxides and sulfides from electric contacts and for providing protection against corrosion, ensures non-obstructed electricity flow especially in the case of oxidized or worn contacts, can be used in audio products -high and low-frequency, electronic industry and in other places where clean contacts are required. - Restores low resistance in connections- Has cleaning properties- Used in audio technologies- Protection against moisture and corrosion- Prevents stray current Code Q0023 Available Price €4.79
Two-component silicone encapsulating compound 011 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 011 features: - Mixing ratio: 100: 8,- Density: 0.97g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 2000 cP,- Transparent color. Code Q0082 ✗ Out-of-Stock Price €11.39
Flux Solid Resin Rosin 20g Flux rosin, solid resin, neutral pH for correct electronic soldering - They do not cause corrosion of non-ferrous metals - Does not cause short circuits Melts with temperature, spreads over the area to be welded and penetrates into the most difficult corners cleans and prepares the surfaces and components to be welded, and facilitates adhesion and tin fluidity, improving soldering in electronics jobs. Use a toothpick for the application. Do not apply excessively. Safety: - Use in ventilated spaces. Do not inhale the fumes that are given off by welding. - Keep the bottle tightly closed and out of the reach of children. - Do not ingest. Non-toxic - Rarely irritating to skin contact Code Q0010 Available Price €1.69
Electrical Contacts Cleaner Spray + Brush Kontakt S 400ml A preparation to remove oxides and sulphites from electrical contacts and to provide protection against corrosion, ensures the flow of electricity especially in case of rusty or worn contacts.It can be used in audio products - low frequency and high, electronic industry and in other places where clean contacts are required.For cleaning contacts, electrical terminals, alternators, switches, plugs, sockets integrated circuits, lampholders, fuseholders, capacitor contacts, flowmeters etc. 400ml Electrical Contacts Cleaner Spray + Brush features: - Restores low resistance in connections- Used in audio technologies- Protection against moisture and corrosion- High quality - manufactured in EU Code Q0028 Available Price €6.99
NRF24L01 + Wireless Antenna Transceiver 2.4 GHz 1Km PA LNA - This module includes PA preamplifier and LNA (Low-noise amplifier)- Comes with the SMA antenna for 2.4GHz (2dB)- Outdoor - transmission up to 250kbps and a distance of up to 1 kilometer- Works at 2.4GHz frequencies (free frequency) and is ideal for telemetry projects, robots, peripherals control, video game control applications, remote temperature sensors, pressure, alarms, etc ... NRF24L01 + Wireless Antenna Transceiver 2.4 GHz 1Km PA LNA features: * Based on chip NRF24L01 +* Free band: 2.4GHz ISM* Speed: 250kbps, 1Mbps, 2Mbps* Work current- Reception: 45 mA- Transmission: 115 mA (4.2uA -sleep mode)* Receiving sensitivity:-104dB 250kbps- 95dB 1Mbps- 92dB 2Mbps* SPI interface Code W0063 Available Regular price €6.95 -€1.50 Price €5.45
Electrostatic Brush ZD-155D 160 mm Use the right tool for every need.It is a special electrostatic brush for cleaning electronic components or places where the electrostatic charge must be taken into account. Electrostatic Brush ZD-155D 160 mm features: - Model: ZD-155D- Brush length: 160 mm- Hair length: 25 mm- Number of hair groups: 6 Code H0135 Available Price €1.79
Two-component silicone encapsulating compound 029 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 029 features: - Manufacturer: TermoPasty,- Mixing ratio: 100: 10,- Thermal conductivity: 2 W / mK,- Density: 1.15g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC, Code Q0085 ✗ Out-of-Stock Price €13.90
Two-component silicone encapsulating compound 019 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 019 features: - Manufacturer: TermoPasty,- Mixing ratio: 100:6,- Density: 1.2g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 45000 cP, Code Q0083 Available Price €13.90
Silicone Gun 15W Silicone Gun 15W features: - Hot glue hot melt adhesive + 2 bars- Blister packaging- Consumption: 15W- Includes 2 silicone bars 7,4mm x 95mm Code H0185 Available Regular price €4.19 -€0.70 Price €3.49
12 Bars of 7mm Hot Silicone Glue Gun 12 Bars of 7mm Hot Silicone Glue Gun features:- Hot melt adhesive- Blister packaging- Includes 12 silicone bars 7.2mm x 100mm Code H0102 Available Regular price €2.39 -€0.90 Price €1.49
Filling compound Epoxy resin 141 Bicomponent high quality Epoxy resin is an encapsulating, two-component mixture. Cures at room temperature. Excellent electrical insulation and good adhesion to virtually all materials. Ideal for potting or filling gaps in heat-generating electronic components with metal enclosures or heat sinks. Code Q0118 ✗ Out-of-Stock Price €7.39
Silicone Gun 60W Silicone Gun 60W, Hot glue hot melt adhesive + 2 bars, Blister packaging, Consumption: 60W.Includes 2 silicone bars 11mm x 95mm Code H0125 Last items in stock Regular price €8.90 -€1.50 Price €7.40
Two-component silicone encapsulating compound 011 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 011 features: - Mixing ratio: 100: 8,- Density: 0.97g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 2000 cP,- Transparent color. Code Q0082 ✗ Out-of-Stock Price €11.39
Filling compound Epoxy resin 149 Bicomponent high quality Epoxy resin is an encapsulating, two-component mixture. Cures at room temperature. Excellent electrical insulation and good adhesion to virtually all materials. Ideal for potting or filling gaps in heat-generating electronic components with metal enclosures or heat sinks. Code Q0119 ✗ Out-of-Stock Price €6.75
Two-component silicone encapsulating compound 021 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 021 features: - Manufacturer: TermoPasty,Mixing ratio: 100: 10,Thermal conductivity: 1.2 W / mK,Density: 1.12g / cm3,Pre-crosslinking: 30-40 min,Working temperature from -50ºC to + 200ºC, Code Q0084 ✗ Out-of-Stock Price €9.90
Two-component silicone encapsulating compound 029 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 029 features: - Manufacturer: TermoPasty,- Mixing ratio: 100: 10,- Thermal conductivity: 2 W / mK,- Density: 1.15g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC, Code Q0085 ✗ Out-of-Stock Price €13.90
Two-component silicone encapsulating compound 019 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 019 features: - Manufacturer: TermoPasty,- Mixing ratio: 100:6,- Density: 1.2g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 45000 cP, Code Q0083 Available Price €13.90
Silicone Gun 15W Silicone Gun 15W features: - Hot glue hot melt adhesive + 2 bars- Blister packaging- Consumption: 15W- Includes 2 silicone bars 7,4mm x 95mm Code H0185 Available Regular price €4.19 -€0.70 Price €3.49
12 Bars of 7mm Hot Silicone Glue Gun 12 Bars of 7mm Hot Silicone Glue Gun features:- Hot melt adhesive- Blister packaging- Includes 12 silicone bars 7.2mm x 100mm Code H0102 Available Regular price €2.39 -€0.90 Price €1.49
Filling compound Epoxy resin 141 Bicomponent high quality Epoxy resin is an encapsulating, two-component mixture. Cures at room temperature. Excellent electrical insulation and good adhesion to virtually all materials. Ideal for potting or filling gaps in heat-generating electronic components with metal enclosures or heat sinks. Code Q0118 ✗ Out-of-Stock Price €7.39
Silicone Gun 60W Silicone Gun 60W, Hot glue hot melt adhesive + 2 bars, Blister packaging, Consumption: 60W.Includes 2 silicone bars 11mm x 95mm Code H0125 Last items in stock Regular price €8.90 -€1.50 Price €7.40
Two-component silicone encapsulating compound 011 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 011 features: - Mixing ratio: 100: 8,- Density: 0.97g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 2000 cP,- Transparent color. Code Q0082 ✗ Out-of-Stock Price €11.39
Filling compound Epoxy resin 149 Bicomponent high quality Epoxy resin is an encapsulating, two-component mixture. Cures at room temperature. Excellent electrical insulation and good adhesion to virtually all materials. Ideal for potting or filling gaps in heat-generating electronic components with metal enclosures or heat sinks. Code Q0119 ✗ Out-of-Stock Price €6.75
Two-component silicone encapsulating compound 021 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 021 features: - Manufacturer: TermoPasty,Mixing ratio: 100: 10,Thermal conductivity: 1.2 W / mK,Density: 1.12g / cm3,Pre-crosslinking: 30-40 min,Working temperature from -50ºC to + 200ºC, Code Q0084 ✗ Out-of-Stock Price €9.90