10x Electrolytic Capacitor 100 uF 25V 105ºC for Arduino 10x Electrolytic Capacitor 100 uF 25V 105ºC Arduino features:-Type: Electrolytic Capacitor-Assembly: intern-Value: 100uF-Maximum tension: 25V-Maximum temperature: 105º C-Dimensions: 6x11mm-Quantity: 10 units Code D0044 Available Price €0.11
Double Side Prototype Board PCB 8x12cm Double Side Prototype Board PCB 8x12cm features: -Thickness of PCB: 1.6mm-Material: high quality FR-4 glass fiber PCB-Presented and numbered on both sides-Top and bottom are identical copper layers-Pads grid (pitch) 2.54mm/0.1", hole diameter 0.9mm Code PB018 Available Price €2.22
300 Pieces LED Diodes 3mm 5mm red green yellow blue white Set of 300 diodes packed in a handy box. Lens colour: red, green, yellow, yellow, blue - diffuse, light white. Code P0104 Available Regular price €6.57 -€1.46 Price €5.11
Ceramic Capacitor 100nF 50v 104 Ceramic Capacitor 100nF (0,1uF) 50v 104 PCB PIC Arduino features: Orders only in multiples of 20 units-Type: Ceramic Y5V-Tolerance: +80/-20%-Dimensions: diameter 9.5mm, pitch 5.08mm Code D0057 Available Price €0.05
Resistor 330 Ohm 5% 0,25W 1/4W Resistor 330 Ohm 5% 0,25W 1/4W features:-1 unit - 330 Ohm-Type: Carbon film-Tolerance: ±5%-Power: 0.25W-Dimensions: 2x7mm Code D0077 Available Price €0.07
20x Ceramic Capacitor 22pF 50v 2,54 20x Ceramic Capacitor 22pF 50v 2,54 PCB PIC Arduino 0.022uF features:-Type: Ceramic NPO-Tolerance: +/-5%-Dimensions: diameter 5mm, pitch 2.54mm Code D0062 Available Price €0.04
Nano plate V3.0 CH340 + Arduino compatible pins It has an ATMega328P chip running at 16Mhz with a factory loaded bootloader Characteristic: - Microcontroller: ATmega328 - Operating Voltage (logic level): 5V - Input Voltage (recommended): 7-12V - Digital I / O Pins: 14 (6 PWM outputs) - Analog Inputs: 8 (A0-A7) - DC Current per Pin I / O 40 mA - Flash Memory: 32 KB (2 KB used by the bootloader) - SRAM: 2 KB - EEPROM: 1 KB - Clock Frequency: 16 MHz - USB Communication - CH340 - Dimensions: 18 mm x 44 mm Code B0026 Available Price €8.26
Isopropyl Alcohol Spray IPA Plus 60mL Isopropyl alcohol is used for cleaning: - Of electronic devices, such as contact tips (like those of ROM cartridges)- Magnetic tapes and disc heads (such as those of audio and video recorders and floppy disk drives)- Laser lenses in optical disk drives (for example: CD, DVD) and thermal paste removal from heat sinks and integrated circuit packages (for example: CPU) of the keyboard and LCD screen Very used in the cleaning of lenses of photographic lenses and contacts of electronic devices, since it does not leave marks and is of rapid evaporation. It is sold commercially also as a cleaner for slates. Code Q0037 Available Price €2.44
Silicone compound 031 Double-component gel The compound perfectly protects the electronics from negative environmental characteristics and protects sensitive modules from vibrations.The silicone gel is crystalline, resistant to UV light and, therefore, is the perfect material for LED applications.After curing, it is very soft.Creates an excellent electrical insulation.It has a wide range of temperatures, from -55 ° C to 200 ° C. Silicone compound 031 Double-component gel features: - Mixing ratio: 3: 2,- Density: 0.98g / cm3,- Pre-crosslinking: 50-60 min,- Working temperature from -50ºC to + 180ºC,- Viscosity at 25ºC: 2000 cP,- Transparent color. Mode of use: - Clean, degrease and dry the system. Code Q0086 ✗ Out-of-Stock Price €8.18
Two-component silicone encapsulating compound 019 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 019 features: - Manufacturer: TermoPasty,- Mixing ratio: 100:6,- Density: 1.2g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 45000 cP, Code Q0083 Available Price €11.49
Filling compound Epoxy resin 149 Bicomponent high quality Epoxy resin is an encapsulating, two-component mixture. Cures at room temperature. Excellent electrical insulation and good adhesion to virtually all materials. Ideal for potting or filling gaps in heat-generating electronic components with metal enclosures or heat sinks. Code Q0119 ✗ Out-of-Stock Price €5.58
Silicone Gun 15W Silicone Gun 15W features: - Hot glue hot melt adhesive + 2 bars- Blister packaging- Consumption: 15W- Includes 2 silicone bars 7,4mm x 95mm Code H0185 Available Regular price €3.46 -€0.70 Price €2.76
Silicone Gun 60W Silicone Gun 60W, Hot glue hot melt adhesive + 2 bars, Blister packaging, Consumption: 60W.Includes 2 silicone bars 11mm x 95mm Code H0125 Last items in stock Regular price €7.36 -€1.50 Price €5.86
Two-component silicone encapsulating compound 011 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 011 features: - Mixing ratio: 100: 8,- Density: 0.97g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 2000 cP,- Transparent color. Code Q0082 ✗ Out-of-Stock Price €9.41
Two-component silicone encapsulating compound 021 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 021 features: - Manufacturer: TermoPasty,Mixing ratio: 100: 10,Thermal conductivity: 1.2 W / mK,Density: 1.12g / cm3,Pre-crosslinking: 30-40 min,Working temperature from -50ºC to + 200ºC, Code Q0084 ✗ Out-of-Stock Price €8.18
12 Bars of 7mm Hot Silicone Glue Gun 12 Bars of 7mm Hot Silicone Glue Gun features:- Hot melt adhesive- Blister packaging- Includes 12 silicone bars 7.2mm x 100mm Code H0102 Available Regular price €1.98 -€0.90 Price €1.08
Filling compound Epoxy resin 141 Bicomponent high quality Epoxy resin is an encapsulating, two-component mixture. Cures at room temperature. Excellent electrical insulation and good adhesion to virtually all materials. Ideal for potting or filling gaps in heat-generating electronic components with metal enclosures or heat sinks. Code Q0118 ✗ Out-of-Stock Price €6.11
Silicone compound 031 Double-component gel The compound perfectly protects the electronics from negative environmental characteristics and protects sensitive modules from vibrations.The silicone gel is crystalline, resistant to UV light and, therefore, is the perfect material for LED applications.After curing, it is very soft.Creates an excellent electrical insulation.It has a wide range of temperatures, from -55 ° C to 200 ° C. Silicone compound 031 Double-component gel features: - Mixing ratio: 3: 2,- Density: 0.98g / cm3,- Pre-crosslinking: 50-60 min,- Working temperature from -50ºC to + 180ºC,- Viscosity at 25ºC: 2000 cP,- Transparent color. Mode of use: - Clean, degrease and dry the system. Code Q0086 ✗ Out-of-Stock Price €8.18
Two-component silicone encapsulating compound 019 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 019 features: - Manufacturer: TermoPasty,- Mixing ratio: 100:6,- Density: 1.2g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 45000 cP, Code Q0083 Available Price €11.49
Filling compound Epoxy resin 149 Bicomponent high quality Epoxy resin is an encapsulating, two-component mixture. Cures at room temperature. Excellent electrical insulation and good adhesion to virtually all materials. Ideal for potting or filling gaps in heat-generating electronic components with metal enclosures or heat sinks. Code Q0119 ✗ Out-of-Stock Price €5.58
Silicone Gun 15W Silicone Gun 15W features: - Hot glue hot melt adhesive + 2 bars- Blister packaging- Consumption: 15W- Includes 2 silicone bars 7,4mm x 95mm Code H0185 Available Regular price €3.46 -€0.70 Price €2.76
Silicone Gun 60W Silicone Gun 60W, Hot glue hot melt adhesive + 2 bars, Blister packaging, Consumption: 60W.Includes 2 silicone bars 11mm x 95mm Code H0125 Last items in stock Regular price €7.36 -€1.50 Price €5.86
Two-component silicone encapsulating compound 011 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 011 features: - Mixing ratio: 100: 8,- Density: 0.97g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 2000 cP,- Transparent color. Code Q0082 ✗ Out-of-Stock Price €9.41
Two-component silicone encapsulating compound 021 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 021 features: - Manufacturer: TermoPasty,Mixing ratio: 100: 10,Thermal conductivity: 1.2 W / mK,Density: 1.12g / cm3,Pre-crosslinking: 30-40 min,Working temperature from -50ºC to + 200ºC, Code Q0084 ✗ Out-of-Stock Price €8.18
12 Bars of 7mm Hot Silicone Glue Gun 12 Bars of 7mm Hot Silicone Glue Gun features:- Hot melt adhesive- Blister packaging- Includes 12 silicone bars 7.2mm x 100mm Code H0102 Available Regular price €1.98 -€0.90 Price €1.08
Filling compound Epoxy resin 141 Bicomponent high quality Epoxy resin is an encapsulating, two-component mixture. Cures at room temperature. Excellent electrical insulation and good adhesion to virtually all materials. Ideal for potting or filling gaps in heat-generating electronic components with metal enclosures or heat sinks. Code Q0118 ✗ Out-of-Stock Price €6.11