Two-component silicone encapsulating compound 019

Epoxy resin is an encapsulating, two-component mixture. Cures at room temperature. Excellent electrical insulation and good adhesion to virtually all materials. Ideal for potting or filling gaps in heat-generating electronic components with metal enclosures or heat sinks. 

Silicone Gun 60W, Hot glue hot melt adhesive + 2 bars, Blister packaging, Consumption: 60W.
Includes 2 silicone bars 11mm x 95mm

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 021 features:
- Manufacturer: TermoPasty,
Mixing ratio: 100: 10,
Thermal conductivity: 1.2 W / mK,
Density: 1.12g / cm3,
Pre-crosslinking: 30-40 min,
Working temperature from -50ºC to + 200ºC,

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 029 features:
- Manufacturer: TermoPasty,
- Mixing ratio: 100: 10,
- Thermal conductivity: 2 W / mK,
- Density: 1.15g / cm3,
- Pre-crosslinking: 30-40 min,
- Working temperature from -50ºC to + 200ºC,

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 011 features:
- Mixing ratio: 100: 8,
- Density: 0.97g / cm3,
- Pre-crosslinking: 30-40 min,
- Working temperature from -50ºC to + 200ºC,
- Viscosity at 25ºC: 2000 cP,
- Transparent color.

Silicone Gun 15W features:
- Hot glue hot melt adhesive + 2 bars
- Blister packaging
- Consumption: 15W
- Includes 2 silicone bars 7,4mm x 95mm

The compound perfectly protects the electronics from negative environmental characteristics and protects sensitive modules from vibrations.
The silicone gel is crystalline, resistant to UV light and, therefore, is the perfect material for LED applications.
After curing, it is very soft.
Creates an excellent electrical insulation.
It has a wide range of temperatures, from -55 ° C to 200 ° C.
Silicone compound 031 Double-component gel features:
- Mixing ratio: 3: 2,
- Density: 0.98g / cm3,
- Pre-crosslinking: 50-60 min,
- Working temperature from -50ºC to + 180ºC,
- Viscosity at 25ºC: 2000 cP,
- Transparent color.
Mode of use:
- Clean, degrease and dry the system.

12 Bars of 7mm Hot Silicone Glue Gun features:
- Hot melt adhesive
- Blister packaging
- Includes 12 silicone bars 7.2mm x 100mm

Epoxy resin is an encapsulating, two-component mixture. Cures at room temperature. Excellent electrical insulation and good adhesion to virtually all materials. Ideal for potting or filling gaps in heat-generating electronic components with metal enclosures or heat sinks.