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In our offer we also have a variety of tools that can help you with your projects. Easily browse through the specific filters and find all the products you need, from pliers and screwdrivers to fastening and soldering materials.

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Showing 1-12 of 12 item(s)

Thermally Conductive Silicone Paste H 7g

Thermally Conductive Silicone Paste H facilitates the transfer of heat between the electronic components and the radiator. It is necessary for the correct operation of any type of temperature sensors. Global coefficient of heat transfer at 0-150 ° C: 0.88 W / m K

Q0051

Price €1.45

Two-component silicone encapsulating compound 011

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 011 features:
- Mixing ratio: 100: 8,
- Density: 0.97g / cm3,
- Pre-crosslinking: 30-40 min,
- Working temperature from -50ºC to + 200ºC,
- Viscosity at 25ºC: 2000 cP,
- Transparent color.

Q0082

Price €11.39

Two-component silicone encapsulating compound 019

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 019 features:
- Manufacturer: TermoPasty,
- Mixing ratio: 100:6,
- Density: 1.2g / cm3,
- Pre-crosslinking: 30-40 min,
- Working temperature from -50ºC to + 200ºC,
- Viscosity at 25ºC: 45000 cP,

Q0083

Price €13.90

Two-component silicone encapsulating compound 021

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 021 features:
- Manufacturer: TermoPasty,
Mixing ratio: 100: 10,
Thermal conductivity: 1.2 W / mK,
Density: 1.12g / cm3,
Pre-crosslinking: 30-40 min,
Working temperature from -50ºC to + 200ºC,

Q0084

Price €9.90

Two-component silicone encapsulating compound 029

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 029 features:
- Manufacturer: TermoPasty,
- Mixing ratio: 100: 10,
- Thermal conductivity: 2 W / mK,
- Density: 1.15g / cm3,
- Pre-crosslinking: 30-40 min,
- Working temperature from -50ºC to + 200ºC,

Q0085

Price €13.90

Silicone Thermal Conductive Paste H 0.5g

Silicone Thermal Conductive Paste 0.5g Heatsink 3D features:
It facilitates the transfer of heat between the electronic components and the radiator.
It's necessary for the correct operation of any type of temperature sensors.
Is characterized by a very good chemical resistance for oxidation, water solutions of acids, alkalis and salts, sulfur dioxide and ammonia. It has a very wide range of working temperatures.
-Density at 20°C: 2.58 G/cm3
-Points: 350°C
-Freezing point: -50°C
-Coefficient of refraction: 1.405,
- Specific temperature at 50°C: 0.243 Cal/g K
-Co-efficient global heat transfer at 0-150°C: 0.88 W/m K
-Constant dielectric at 100 Hz: 4.7 (± 0.1)
-Cross resistance: 5x10 to power 14 Ohm x cm

Q0080

Price €0.59

Thermal Paste Syringe 3.1W / mK - AG Copper

Copper-based thermal paste designed to improve processor cooling Thermal Paste Syringe 3.1W / mK CPU features:
- The thermal conductivity of ~ 3.1 W/mK
- Not suitable for aluminum radiators
- No driver
- 1,5ml content

Q0042

Price €2.95

Adhesive Thermal Paste Glue 10g CPU

Totally new and of high quality.
Dissipate the heat of the computer by refrigerating it effectively.
It is used to attach passive dissipaters to graphic memories and chip plates and LED diodes.
Make sure to put the components correctly, once it has dried it will not be able to detach. Adhesive Thermal Paste Glue 10g CPU features:
  - Color white
- Surface drying time [25 ° C, min]: 2- 8
- Hardness: 45 -75
- Tensile strenght (Mpa): 2.0
- Elongation (%): 100
- Thermal Conductivity W / mk:> 1,0
- Volume Resistance (c-in / W): <2.0 x 10 * 15
- Dielectric strength (KV / mm): 20
- Dielectric Constant: 3.0
- Dielectric loss factor (60Hz): 0.003
- Operating temperature (max): 200 ° C

Q0006

Price €3.95

Silicone Thermal Paste Syringe 25g

Silicone Thermal Paste Syringe 25g features:
- Density at 20°C: 2.58 G/cm3
- Flashpoints: 350°C
- Freezing point: -50°C
- Coefficient of refraction: 1.405,
- Specific temperature at 50°C: 0.243 Cal/g K
- Co-efficient global heat transfer at 0-150°C: 0.78 W/m K
- Constant dielectric at 100 Hz: 4.7 (± 0.1)
- Cross resistance: 5 x 10 to the power 14 Ohm x cm
- Loss rate at f = 100 Hz: 0.020 (± 0.003)
- Range of operating temperature: -50~200°C

Q0008

Price €4.79

Thermal conductive paste HP 340°C 100g

The transfer of heat between the electronic components and the radiator is facilitated.
It is necessary for the correct operation of any type of temperature sensors.
It is characterized by a very good chemical resistance for oxidation, water solutions of acids, alkalis and salts, sulfur dioxide and ammonia. Thermo Conductive Grease Paste 340°C 3D Prusa 100g features:
- It has a very wide range of working temperatures: -30 °C ~ 300 °C
- Maximum momentary working temperature 340 °C
- Thermal conductivity> 1.5 W / mK

Q0050

Price €10.99

Thermally Conductive Silicone Paste HP 7g

Thermally Conductive Silicone Paste facilitates the transfer of heat between the electronic components and the radiator. It is necessary for the correct operation of any type of temperature sensors. It is characterized by a very good chemical resistance for oxidation, water solutions of acids, alkalis and salts, sulfur dioxide and ammonia.

Q0146

Price €2.49

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  • Tipo: Encapsulante de silicona
  • Tipo: Pasta térmica