Two-component silicone encapsulating compound 011 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 011 features: - Mixing ratio: 100: 8,- Density: 0.97g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 2000 cP,- Transparent color. Code Q0082 ✗ Out-of-Stock Price €11.39
Two-component silicone encapsulating compound 019 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 019 features: - Manufacturer: TermoPasty,- Mixing ratio: 100:6,- Density: 1.2g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 45000 cP, Code Q0083 Available Price €13.90
Two-component silicone encapsulating compound 021 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 021 features: - Manufacturer: TermoPasty,Mixing ratio: 100: 10,Thermal conductivity: 1.2 W / mK,Density: 1.12g / cm3,Pre-crosslinking: 30-40 min,Working temperature from -50ºC to + 200ºC, Code Q0084 ✗ Out-of-Stock Price €9.90
Two-component silicone encapsulating compound 029 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 029 features: - Manufacturer: TermoPasty,- Mixing ratio: 100: 10,- Thermal conductivity: 2 W / mK,- Density: 1.15g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC, Code Q0085 ✗ Out-of-Stock Price €13.90