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Showing 1-7 of 7 item(s)

Two-component silicone encapsulating compound 011

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 011 features:
- Mixing ratio: 100: 8,
- Density: 0.97g / cm3,
- Pre-crosslinking: 30-40 min,
- Working temperature from -50ºC to + 200ºC,
- Viscosity at 25ºC: 2000 cP,
- Transparent color.

Q0082

Price €11.39

Two-component silicone encapsulating compound 019

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 019 features:
- Manufacturer: TermoPasty,
- Mixing ratio: 100:6,
- Density: 1.2g / cm3,
- Pre-crosslinking: 30-40 min,
- Working temperature from -50ºC to + 200ºC,
- Viscosity at 25ºC: 45000 cP,

Q0083

Price €13.90

Two-component silicone encapsulating compound 021

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 021 features:
- Manufacturer: TermoPasty,
Mixing ratio: 100: 10,
Thermal conductivity: 1.2 W / mK,
Density: 1.12g / cm3,
Pre-crosslinking: 30-40 min,
Working temperature from -50ºC to + 200ºC,

Q0084

Price €9.90

Two-component silicone encapsulating compound 029

The product is a liquid, two component encapsulation mixture.
The curing takes place at room temperature.
The material provides thermal conductivity and low expansion.
Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.
It has an excellent fluidity when dosing and encapsulating.
After curing, it does not detach due to cyclic heating of the surface to which it adheres.
The cured product is dry to the touch.
Two-component silicone encapsulating compound 029 features:
- Manufacturer: TermoPasty,
- Mixing ratio: 100: 10,
- Thermal conductivity: 2 W / mK,
- Density: 1.15g / cm3,
- Pre-crosslinking: 30-40 min,
- Working temperature from -50ºC to + 200ºC,

Q0085

Price €13.90

Technical Petrolatum 65ml

Vaseline Technical Grease 20g features:
- Lubricates moving surfaces, bearings,
- Protects metal parts against corrosion and electrical contacts
- Protects and preserves rubber and plastic
- It can be used as mounting grease
- Eliminates squeaks
- Reduces and decreases friction

Q0064

Price €1.39

Technical Petrolatum 35g

- The electrical products and lubricants of the bearings
- Its working temperature is up to 30 °C Technical Vaseline for Contacts and Bearings 35g features:
- Solid product
- White color
- Specific smell
- Melting point: 56 °C
- Ignition temperature: 220 °C
- Density at 20 °C: 822 kg / m3
- Maximum temperature of use: 30 °C
- Solubility in water: partial

Q0081

Price €1.59

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  • Tipo: Encapsulante de silicona
  • Tipo: Vaselina