Thermal Pad - 1,5 W/mK - AG Thermopad Thermal Pad Silicone Heat Pad CPU GPU features: - The transfer of heat between the electronic components and the radiator is facilitated.- Thermal conductivity 1,5W / mK- Thickness 1mm quantity: 1 unit- High quality - manufactured in EU- Thermopad 100x20x1mm- Thermally conductive tapes are used if the application of a thermal paste is not possible. The tapes are extremely flexible. Their high compressibility ensures excellent adjustment to elements in need of cooling Code Q0039 Available Price €1.29
Thermal Pad 6W/mK - AG Thermopad Thermal Pad Silicone Heat GPU CPU 130x20x1mm. The tapes are thermally used as an application of a thermal paste. Code Q0044 Available Price €4.39
TO Thermal Conductive Pad 26x26x0.3mm 1.5W/mK TO Thermal Conductive Pad 26x26x0.3mm 1.5W/mK features: - The thermal conductive pads with a thermal conductivity of 1.5 W / mK, are a good thermal conductor and at the same time a good electrical insulator- A double-sided adhesive product, reinforced with fiberglass- Dimensions: 26x26x0,3mm Code Q0074 Available Price €0.50
Thermal Conductive Pad TO3 41.5x28.2x0.3mm 1.5W/mK Thermal Conductive Pad TO3 41.5x28.2x0.3mm 1.5W/mK features: - The thermal conductive pads with a thermal conductivity of 1.5 W / mK, are a good thermal conductor and at the same time a good electrical insulator- A double-sided adhesive product, reinforced with fiberglass- Dimensions: 41.5x28.2x0.3mm Code Q0075 ✗ Out-of-Stock Price €0.50
Thermal Conductive Pad TO247 23x18x0.3mm 1.5W/mK Thermal Conductive Pad TO247 23x18x0.3mm 1.5W/mK features: - The thermal conductive pads with a thermal conductivity of 1.5 W / mK, are a good thermal conductor and at the same time a good electrical insulator- A double-sided adhesive product, reinforced with fiberglass.- Dimensions: 23x18x0,3mm Code Q0076 Available Price €0.50
Two-component silicone encapsulating compound 011 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 011 features: - Mixing ratio: 100: 8,- Density: 0.97g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 2000 cP,- Transparent color. Code Q0082 ✗ Out-of-Stock Price €11.39
Two-component silicone encapsulating compound 019 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 019 features: - Manufacturer: TermoPasty,- Mixing ratio: 100:6,- Density: 1.2g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 45000 cP, Code Q0083 Available Price €13.90
Two-component silicone encapsulating compound 021 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 021 features: - Manufacturer: TermoPasty,Mixing ratio: 100: 10,Thermal conductivity: 1.2 W / mK,Density: 1.12g / cm3,Pre-crosslinking: 30-40 min,Working temperature from -50ºC to + 200ºC, Code Q0084 ✗ Out-of-Stock Price €9.90
Two-component silicone encapsulating compound 029 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 029 features: - Manufacturer: TermoPasty,- Mixing ratio: 100: 10,- Thermal conductivity: 2 W / mK,- Density: 1.15g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC, Code Q0085 ✗ Out-of-Stock Price €13.90
Thermal Conductive Pad TO220 18x13x0.3mm 1.5W/mK Thermal Conductive Pad TO220 18x13x0.3mm 1.5W/mK features: - The thermal conductive pads with a thermal conductivity of 1.5 W / mK, are a good thermal conductor and at the same time a good electrical insulator- A double-sided adhesive product, reinforced with fiberglass- Dimensions: 18x13x0,3mm Code Q0077 Available Price €0.50