Thermal Conductive Pad TO3 41.5x28.2x0.3mm 1.5W/mK Thermal Conductive Pad TO3 41.5x28.2x0.3mm 1.5W/mK features: - The thermal conductive pads with a thermal conductivity of 1.5 W / mK, are a good thermal conductor and at the same time a good electrical insulator- A double-sided adhesive product, reinforced with fiberglass- Dimensions: 41.5x28.2x0.3mm Code Q0075 ✗ Out-of-Stock Price €0.50
Thermal Conductive Pad TO247 23x18x0.3mm 1.5W/mK Thermal Conductive Pad TO247 23x18x0.3mm 1.5W/mK features: - The thermal conductive pads with a thermal conductivity of 1.5 W / mK, are a good thermal conductor and at the same time a good electrical insulator- A double-sided adhesive product, reinforced with fiberglass.- Dimensions: 23x18x0,3mm Code Q0076 Available Price €0.50
Two-component silicone encapsulating compound 011 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 011 features: - Mixing ratio: 100: 8,- Density: 0.97g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 2000 cP,- Transparent color. Code Q0082 ✗ Out-of-Stock Price €11.39
Two-component silicone encapsulating compound 019 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 019 features: - Manufacturer: TermoPasty,- Mixing ratio: 100:6,- Density: 1.2g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC,- Viscosity at 25ºC: 45000 cP, Code Q0083 Available Price €13.90
Two-component silicone encapsulating compound 021 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 021 features: - Manufacturer: TermoPasty,Mixing ratio: 100: 10,Thermal conductivity: 1.2 W / mK,Density: 1.12g / cm3,Pre-crosslinking: 30-40 min,Working temperature from -50ºC to + 200ºC, Code Q0084 ✗ Out-of-Stock Price €9.90
Silicone compound 031 Double-component gel The compound perfectly protects the electronics from negative environmental characteristics and protects sensitive modules from vibrations.The silicone gel is crystalline, resistant to UV light and, therefore, is the perfect material for LED applications.After curing, it is very soft.Creates an excellent electrical insulation.It has a wide range of temperatures, from -55 ° C to 200 ° C. Silicone compound 031 Double-component gel features: - Mixing ratio: 3: 2,- Density: 0.98g / cm3,- Pre-crosslinking: 50-60 min,- Working temperature from -50ºC to + 180ºC,- Viscosity at 25ºC: 2000 cP,- Transparent color. Mode of use: - Clean, degrease and dry the system. Code Q0086 ✗ Out-of-Stock Price €9.90
Two-component silicone encapsulating compound 029 The product is a liquid, two component encapsulation mixture.The curing takes place at room temperature.The material provides thermal conductivity and low expansion.Ideal for encapsulating or filling gaps in electronic heat generating components with metal enclosures or heat sinks.It has an excellent fluidity when dosing and encapsulating.After curing, it does not detach due to cyclic heating of the surface to which it adheres.The cured product is dry to the touch. Two-component silicone encapsulating compound 029 features: - Manufacturer: TermoPasty,- Mixing ratio: 100: 10,- Thermal conductivity: 2 W / mK,- Density: 1.15g / cm3,- Pre-crosslinking: 30-40 min,- Working temperature from -50ºC to + 200ºC, Code Q0085 ✗ Out-of-Stock Price €13.90
AG Extreme thermal grease 3g syringe The AG Extreme paste provides excellent heat conduction between elements such as: a radiator that discharges heat and a fan, CPU, GPU.The substance is a dielectric (it is not an electrical conductor), which protects against various electrical hazards. Thermal conductivity 6W/mK. Code Q0087 Available Price €6.85
AG Extreme thermal grease 4g flask Ideal for any processor, chip set, GPU and other subsets. It is characterized by a good thermal conductivity due to the use of diamond dust.A special brush facilitates the application of the paste.Diamond powder content: 10% AG Extreme thermal grease 4g flask features: - Manufacturer: TermoPasty,- Thermal conductivity:> 4 W / mK,- Thermal impedance: <0.065 ° C in2 / W- Specific gravity:> 2.4g / cm3,- Evaporation: <0.001%,- Fluency: <0.001%,- Electrical conductivity: insulation,- Viscosity: 1000 cP,- Working temperature from -40ºC to + 300ºC,- Supported temperatures: -40ºC to + 350ºC,- Gray. Mode of use: - Store in a well ventilated, cool and dry place. Code Q0088 Available Price €9.85
AG Silver thermal grease 3g syringe AG Silver is a thermal conductive paste with the addition of silver compounds. Its thermal conductivity is much greater than the conductivity of typical carbon-silicon compounds. Thermal conductivity 3.8W/mK. Code Q0089 Available Price €3.90