Adhesive Thermal Paste Glue 10g CPU description
Totally new and of high quality.
Dissipate the heat of the computer by refrigerating it effectively.
It is used to attach passive dissipaters to graphic memories and chip plates and LED diodes.
Make sure to put the components correctly, once it has dried it will not be able to detach.
Adhesive Thermal Paste Glue 10g CPU features:
- Color white
- Surface drying time [25 ° C, min]: 2- 8
- Hardness: 45 -75
- Tensile strenght (Mpa): 2.0
- Elongation (%): 100
- Thermal Conductivity W / mk:> 1,0
- Volume Resistance (c-in / W): <2.0 x 10 * 15
- Dielectric strength (KV / mm): 20
- Dielectric Constant: 3.0
- Dielectric loss factor (60Hz): 0.003
- Operating temperature (max): 200 ° C
- Pasta térmica