A compound for etching of printed circuit boards and pickling of copper. An ideal alternative to ferric chloride. It is readily soluble and does not crystallize from the solution. It etches evenly, ensures the sharpness of contours and minimizes undercutting.
Usage: Dissolve the preparation in 0.5 l of water at a temperature of 50°C. Perform etching at 40°C (max. 50°C). Bath movement ensures quicker etching. The etching solution must not be stored in hermetically sealed containers due to the risk of developing overpressure and cracks.