Adhesive Thermal Paste Glue 10g CPU
  • Adhesive Thermal Paste Glue 10g CPU

Adhesive Thermal Paste Glue 10g CPU

Totally new and of high quality.
Dissipate the heat of the computer by refrigerating it effectively.
It is used to attach passive dissipaters to graphic memories and chip plates and LED diodes.
Make sure to put the components correctly, once it has dried it will not be able to detach. Adhesive Thermal Paste Glue 10g CPU features:
  - Color white
- Surface drying time [25 ° C, min]: 2- 8
- Hardness: 45 -75
- Tensile strenght (Mpa): 2.0
- Elongation (%): 100
- Thermal Conductivity W / mk:> 1,0
- Volume Resistance (c-in / W): <2.0 x 10 * 15
- Dielectric strength (KV / mm): 20
- Dielectric Constant: 3.0
- Dielectric loss factor (60Hz): 0.003
- Operating temperature (max): 200 ° C

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Q0006
Termopasty
Quantity
Backorder available

Price €2.64

2,18 tax excl.

Tax included
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Adhesive Thermal Paste Glue 10g CPU description


Totally new and of high quality.
Dissipate the heat of the computer by refrigerating it effectively.
It is used to attach passive dissipaters to graphic memories and chip plates and LED diodes.
Make sure to put the components correctly, once it has dried it will not be able to detach.

Adhesive Thermal Paste Glue 10g CPU features:


  - Color white
- Surface drying time [25 ° C, min]: 2- 8
- Hardness: 45 -75
- Tensile strenght (Mpa): 2.0
- Elongation (%): 100
- Thermal Conductivity W / mk:> 1,0
- Volume Resistance (c-in / W): <2.0 x 10 * 15
- Dielectric strength (KV / mm): 20
- Dielectric Constant: 3.0
- Dielectric loss factor (60Hz): 0.003
- Operating temperature (max): 200 ° C

Data sheet

Tipo
Pasta térmica
Forma
Pasta

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